VC nano 3D-Z regular 8/xx

Suitable for working distances from 90-240 mm (regular 8/30) resp. from 50-125 mm (regular 8/44) and with lateral resolutions from 60-120 µm resp. 50-70 µm and vertical reolutions of 10-40 µm resp. 10-20 µm.

VC nano 3D-Z laser profiler - laser triangulation - plan view
Case
Protected to IP67 standard and of course with M12 connectors
Laser
Class 2 blue laser, wavelength 450 nm, 130 mW
Dig. I/Os
10 freely programmable inputs / outputs, encoder and 1 Gbit interface
Embedded Vision
Image capture and processing by a VCSBC nano Z board camera, scan rate up to 2kHz

Quick facts

  • 1/2.9" CMOS
  • Resolution: 1408(H) x 1080(V) active pixels
  • Scanrate: up to 2 kHz max.
  • Flash EPROM: 16 GB
  • Encoder interface: Yes
  • Trigger input: Yes
  • Power Supply: 24 V +/-20 % DC, max. 300 mA
  • Laser: Laser class 2, blue laser, wavelength of 450 nm
  • Power consumption: 7.2 W
  • Dimensions: approx. 140 mm x 83 mm x 37 mm, approx. 400 g
2 kHz
SCAN RATE
450 nm
WAVELENGTH
866
MHz DUAL-CORE ARM
10
PROGRAMMABLE I/Os
140 x 65 x 37
SIZE in mm
Triangulation sensor VC nano 3D Z regular 8

Specifications

Sensor:
1/2.9" CMOS, Sony IMX273LLR, monochrome version
Resolution:
1408(H) x 1080(V), active pixels
Flash EPROM:
16 GB flash memory (Non volatile)
Integration:
Global Shutter
Acquisition:
Program controlled or external high-speed-trigger, full scan & partial scan (AOI)
Processor:
Dual-Core ARM Cortex-A9 @ 2 x 866 MHz and integrated FPGA
RAM:
512 MB DDR-SDRAM
Dig. I/Os:
Programmable I/OS 6 inputs, 4 outputs
Trigger I/Os:
1 trigger input (optoisolated)
Interfaces:
Ethernet 1 Gbit / 100 Mbit / 10 Mbit
Power Supply:
24V DC, 300mA without I/O usage.
Working distance:
90 mm - 240 mm (8/30)
75 mm - 215 mm (8/32)
70 mm - 195 mm (8/34)
65 mm - 175 mm (8/36)
60 mm - 160 mm (8/38)
55 mm - 145 mm (8/40)
50 mm - 135 mm (8/42)
50 mm - 125 mm (8/44)
Horizontal measure range:
65 mm - 150 mm (8/30)
60 mm - 135 mm (8/32)
60 mm - 120 mm (8/34)
60 mm - 110 mm (8/36)
55 mm - 105 mm (8/38)
55 mm - 95 mm (8/40)
55 mm - 90 mm (8/42)
50 mm - 85 mm (8/44)
Resolution lateral:
60 µm - 120 µm (8/30)
50 µm - 110 µm (8/32)
50 µm - 100 µm (8/34)
50 µm - 90 µm (8/36)
50 µm - 90 µm (8/38)
50 µm - 80 µm (8/40)
50 µm - 80 µm (8/42)
50 µm - 70 µm (8/44)
Resolution vertical :
10 µm - 40 µm (8/30)
10 µm - 40 µm (8/32)
10 µm - 30 µm (8/34)
10 µm - 30 µm (8/36)
10 µm - 20 µm (8/38)
10 µm - 20 µm (8/40)
10 µm - 20 µm (8/42)
10 µm - 20 µm (8/44)

The ZYNQ SoC module, basis for the Z models, increases the performance enormously thanks to the freely programmable FPGA. The programming of the FPGA itself has significant advantages whenever low power consumption and high-speed are mandatory.

MICHAEL ENGEL OWNER of Vision Components & INVENTOR OF THE SMART CAMERA
Jan-Erik Schmitt - Vice President of Sales - Vision Components

Your contact for international sales

Sales international
Jan-Erik Schmitt
Vice President of Sales

P +49 7243 2167-23
M +49 176 63 31 85 08
schm8lx0nitt@vision-c4y9domponents.c2qwdfomxkoq
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Endre Tóth - Sales North and South Amercia - Vision Components

Your contact in Americas

Sales Americas
Endre Tóth
Director of Business Development
Vision Components US Office

P +1 603 598-2588
M +1 603 55 77 122
etot0ph@vision-cotbsvkmponents.comlbek
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Sven Klette-Matzat - Sales - OEM Solutions - Vision Components

Your contact for Europe

Sales Europe
Sven Klette-Matzat
Sales Manager/OEM Solutions

P +49 7243 2167-24
M + 49 176 83 04 07 23
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Shinobu Minobe: Sales Japan, Vision Components Japan Office

Your contact in Japan

Sales Japan
Shinobu Minobe
Director of Business Development
Vision Components Japan Office

T +81 (48) 299-4798
M +81 (80) 3023-2314
minobe@vgvisornvxion-components.jp

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Andreas Beising - Sales Asia and Middle East  - Vision Components

Your contact for Asia (excl. Japan) & Middle East

Sales Asia (excl. Japan) & Middle East
Andreas Beising
Director of Business Development

M +49 172 72 59 176
M +971 56 11 56 577
be8tistrrinaig@vision-componqnrents.com/oy
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